High Rate, Low Pressure, High Density Plasma Etch / Deposition System
Selective Etching with Angle Control ...
Gap-Filling Deposition of Silicon or Silicon Dioxide ...
In a Self-Cleaning and Compact Hollow Cathode Single-Wafer Chamber...
Processing for 76mm - 200mm wafer diameters in a compact system
with electrostatic chucking and easy chamber maintenance ...
System Features;
- All-automatic process after placement of wafer on loadlock arm
- Flexible Electrogrip DepEtchPro system automation
- Silane process purge system ensures pump and exhaust safety for Si and Oxide deposition
- Three turbopumps and symmetric gas injection yield exceptional uniformity
- Low particle count for pinhole-free depositions ...
- chamber plasma particle sweep after each run
- periodic self-cleaning etch removes chamber deposits
- pneumatic hoists yield full access to top and bottom chamber plate
- Simple, reliable, low-maintenance ...
- compact system fits in tight spaces
- one rf power supply
- no rf automatch - fixed rf vacuum-capacitor tuning for all runs
- chamber gas flow controls use no MFCs