Gas Flow Control

Electrogrip provides system and component-level solutions:

 

Electrostatic chuck controls must be coordinated with gas backfill and wafer lift.

The GC-3 system controller permits an existing system to

• accept a retrofit electrostatic chuck,
• require only one input signal to drive
  • a flow controller and gas valves to perform gas backfill and purge,
  • turn the DR4/DR5/DR6 grip command on and off,
  • drive a motor to raise and lower wafers, and
  • run process with the required gas, rf, etc.

 

Reliable, Wide-Range Gas Flow Control

Electrogrip's GFC-2 flow controller replaces standard MFC's and features:

• wide range from 0.05sccm to 3slm
• gas-independent self-calibration during operation
• negligible zero-level drift;
• autocalibration and accuracy are independent of line fouling, inlet pressure, etc.

• low-flow version controls 0.05sccm through 3sccm He to permit rapid chuck backfill
  • and yields fine control at the actual chuck leakage rate, typically 0.05-0.1sccm;