Electrogrip Advanced Electrostatic Gripping Solutions - Electrostatic Chucks, High Voltage Power Supplies, Control Sytems, Vacuum Systems

Electrogrip's glass-gripping technology holds non-conductive materials such as

Electrogrip is able to grip through one substrate to grip a second masking substrate.

A mixture of multipolar and interdigitated chuck constructions yields high reliability.

CP style chuck performance gripping a thick sapphire wafer is shown below.

Backpressure and leakage rates while gripping a sapphire wafer

A typical 10 Torr backpressure yields 0.5sccm He leakage,

with a 'popoff' pressure of more than 40 Torr.

A further example of LCD glass-gripping chucks is shown in our other pages.