Electrogrip Advanced Electrostatic Gripping Solutions - Electrostatic Chucks, High Voltage Power Supplies, Control Sytems, Vacuum Systems

The CP series permits the chuck puck to be removed and replaced

... without breaking liquid thermal transfer fluid lines.

The puck mounts with metal-to-metal contact to the service base,

yielding high thermal conduction to the puck.

 

CP assembly with 200mm chuck puck on 200mm service base;

wafer lift motor drive at bottom. Guard ring removed for clarity ...

CP assembly 200mm dia

A similar CP200 chuck assembly, with guard ring

Top view 200mm CP assembly

CP200 series pucks for differing wafer sizes ...

The ceramic composition controls chuck surface appearance.

CP series size range